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Committer:
Øyvind Aabling
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Date:
2010-09-10 13:03:46 UTC
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Revision ID:
oyvind.aabling@uni-c.dk-20100910130346-5nuovdswg3sahxsc
Various bugfixes:
DB/DSUB mounting pad size increased to 7.4mm,
SMD Alu Electrolytes (C-AEC-*): Corrected SMD pad size and positions,
LED silkscreen and 3D house rotated 180deg,
SOD523 had colliding pads.
Added perl/README.perl (a quick and very incomplete perl tutorial)
and perl/README.pcblibs (pcblibs code structure overview).