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SetCopperLayerCount( 2 ); // Default design is a double sided board
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m_CurrentViaType = VIA_THROUGH; // via type (VIA_BLIND_BURIED, VIA_THROUGH VIA_MICROVIA)
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m_CurrentViaType = VIA_THROUGH; // via type (VIA_BLIND_BURIED, VIA_THROUGH, VIA_BACK_DRILLED, VIA_DCD)
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m_UseConnectedTrackWidth = false; // if true, when creating a new track starting on an existing track, use this track width
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m_MicroViasAllowed = false; // true to allow micro vias
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m_DrawSegmentWidth = 100; // current graphic line width (not EDGE layer)
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m_EdgeSegmentWidth = 100; // current graphic line width (EDGE layer only)
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m_PcbTextWidth = 100; // current Pcb (not module) Text width
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m_PcbTextSize = wxSize( 500, 500 ); // current Pcb (not module) Text size
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m_TrackMinWidth = 80; // track min value for width ((min copper size value
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m_ViasMinSize = 350; // vias (not micro vias) min diameter
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m_ViasMinDrill = 200; // vias (not micro vias) min drill diameter
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m_MicroViasMinSize = 200; // micro vias (not vias) min diameter
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m_MicroViasMinDrill = 50; // micro vias (not vias) min drill diameter
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m_MicroViasAllowed = false; // true to allow micro vias
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m_DrawSegmentWidth = DM2P(100); // current graphic line width (not EDGE layer)
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m_EdgeSegmentWidth = DM2P(100); // current graphic line width (EDGE layer only)
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m_PcbTextWidth = DM2P(100); // current Pcb (not module) Text width
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m_PcbTextSize = wxSize(DM2P(500),DM2P(500)); // current Pcb (not module) Text size
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m_TrackClearance = DM2P( 70); // min track to track clearance
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m_ZoneClearance = DM2P(100); // min zone to zone/track/pad clearance
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m_EdgeClearance = DM2P(394); // min edge to copper clearance (outer layers)
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m_EdgeClearanceInner = DM2P(394); // min edge to copper clearance (inner layers)
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m_HoleClearance = DM2P( 60); // min hole to copper edge clearance (outer layers)
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m_HoleClearanceInner = DM2P( 70); // min hole to copper edge clearance (inner layers)
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m_TrackMinWidth = DM2P( 70); // track min value for width ((min copper size value
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m_ViasMinSize = DM2P(238); // vias (not micro vias) min diameter (outer layers)
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m_ViasMinInnerSize = DM2P(258); // vias (not micro vias) min diameter (inner layers)
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m_ViasMinDrill = DM2P(118); // vias (not micro vias) min drill diameter
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m_MicroViasMinSize = DM2P(200); // micro vias (not vias) min diameter
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m_MicroViasMinDrill = DM2P( 50); // micro vias (not vias) min drill diameter
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// Global mask margins:
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m_SolderMaskMargin = 150; // Solder mask margin
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m_SolderPasteMargin = 0; // Solder paste margin absolute value
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m_SolderPasteMarginRatio = 0.0; // Solder pask margin ratio value of pad size
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m_SolderMaskMargin = DM2P(150); // Solder mask margin
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m_PeelMaskMargin = DM2P(150); // Peelable mask margin
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m_SolderPasteMargin = DM2P( 0); // Solder paste margin absolute value
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m_SolderPasteMarginRatio = DM2P(0.0); // Solder pask margin ratio value of pad size
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// The final margin is the sum of these 2 values
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// Usually < 0 because the mask is smaller than pad
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m_BoardThickness = (int)(1.6 * PCB_INTERNAL_UNIT / 25.4); // Epoxy thickness for 3D view (and microwave calculations) // Layer Thickness for 3D viewer
52
m_BoardThickness = DM2P(620); // Epoxy thickness for 3D view (and microwave calculations)
added
removed
pcbnew/class_board_design_settings.cpp
