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  • Committer: Øyvind Aabling
  • Date: 2010-09-10 13:03:46 UTC
  • Revision ID: oyvind.aabling@uni-c.dk-20100910130346-5nuovdswg3sahxsc
Various bugfixes:
  DB/DSUB mounting pad size increased to 7.4mm,
  SMD Alu Electrolytes (C-AEC-*): Corrected SMD pad size and positions,
  LED silkscreen and 3D house rotated 180deg,
  SOD523 had colliding pads.
Added perl/README.perl (a quick and very incomplete perl tutorial)
and perl/README.pcblibs (pcblibs code structure overview).

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Lines of Context:
modules/oaa_SOD.dim
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SODF    |  F  |  H  |  L  |   LS   |  N  |  S  |  W  |   WS   |   X  |   Y  |  Z  |   b  |   c  |
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--------+-----+-----+-----+--------+-----+-----+-----+--------+------+------+-----+------+------+
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SOD123F | 0.7 | 1.1 | 2.7 | 4.5048 | 123 | 3.8 | 1.6 | 1.9048 | 1.80 | 1.34 | 4.2 | 0.60 | 0.13 |
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SOD523  | 0.4 | 0.8 | 1.2 | 2.3048 | 523 | 1.6 | 0.9 | 1.2048 | 0.75 | 1.00 | 2.0 | 0.25 | 0.15 |
 
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SOD523  | 0.4 | 0.8 | 1.2 | 2.3048 | 523 | 1.6 | 0.9 | 1.2048 | 0.75 | 0.80 | 2.0 | 0.25 | 0.15 |
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--------+-----+-----+-----+--------+-----+-----+-----+--------+------+------+-----+------+------+
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SODF: F  = TBW
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SODF: H  = TBW